Alliance Memory, Inc.
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AS4C256M8D3-12BIN
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AS4C256M8D3-12BIN

Product Overview

Category

AS4C256M8D3-12BIN belongs to the category of dynamic random-access memory (DRAM) chips.

Use

It is primarily used as a main memory component in various electronic devices such as computers, servers, and mobile devices.

Characteristics

  • High-speed data storage and retrieval capabilities
  • Volatile memory that requires constant power supply
  • Offers large storage capacity
  • Supports fast read and write operations
  • Requires periodic refreshing to maintain data integrity

Package

AS4C256M8D3-12BIN is available in a compact and standardized package, making it compatible with different circuit boards and systems.

Essence

The essence of AS4C256M8D3-12BIN lies in its ability to provide reliable and efficient data storage and retrieval functions for electronic devices.

Packaging/Quantity

AS4C256M8D3-12BIN is typically packaged in trays or reels, and the quantity per package can vary depending on the manufacturer's specifications.

Specifications

  • Model: AS4C256M8D3-12BIN
  • Memory Type: Dynamic Random-Access Memory (DRAM)
  • Organization: 256 Megabit x 8
  • Operating Voltage: 2.5V - 3.3V
  • Speed: 12ns
  • Interface: Parallel
  • Package Type: BGA (Ball Grid Array)
  • Pin Count: 60 pins

Detailed Pin Configuration

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. WE#
  12. CAS#
  13. RAS#
  14. A0
  15. A1
  16. A2
  17. A3
  18. A4
  19. A5
  20. A6
  21. A7
  22. A8
  23. A9
  24. A10
  25. A11
  26. A12
  27. A13
  28. A14
  29. A15
  30. BA0#
  31. BA1#
  32. VSS
  33. CLK
  34. CKE
  35. CS#
  36. DQM0#
  37. DQM1#
  38. DQM2#
  39. DQM3#
  40. VDD
  41. VDDQ
  42. VREF
  43. VSS
  44. VSSQ
  45. NC
  46. NC
  47. NC
  48. NC
  49. NC
  50. NC
  51. NC
  52. NC
  53. NC
  54. NC
  55. NC
  56. NC
  57. NC
  58. NC
  59. NC
  60. NC

Functional Features

  • High-speed data access and transfer
  • Low power consumption
  • Easy integration into various electronic systems
  • Reliable data storage and retrieval
  • Support for multiple read and write operations simultaneously

Advantages and Disadvantages

Advantages

  • Large storage capacity
  • Fast data access and transfer speeds
  • Compatibility with different electronic devices and systems
  • Cost-effective solution for memory-intensive applications

Disadvantages

  • Volatile memory requires constant power supply
  • Requires periodic refreshing to maintain data integrity
  • Limited lifespan compared to non-volatile memory options

Working Principles

AS4C256M8D3-12BIN operates based on the principles of dynamic random-access memory. It stores data in capacitors within each memory cell, which are organized in a matrix. The stored data is accessed by applying appropriate voltage levels to the memory cells and reading the charge stored in the capacitors.

Detailed Application Field Plans

AS4C256M8D3-12BIN finds applications in various electronic devices and systems, including: - Personal computers - Servers - Laptops - Mobile devices - Networking equipment - Embedded systems

Detailed and Complete Alternative Models

  1. AS4C128M16D3A-12BCN
  2. MT48LC32M8A2P-75:C
  3. K4S561632H-UC75
  4. HYB18T512800AF-3S
  5. M5M5256DFP-70LLI

These alternative models offer similar specifications and functionalities to AS4C256M8D3-12BIN and can be considered as alternatives based on specific requirements and availability.

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Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de AS4C256M8D3-12BIN en soluciones técnicas

  1. Question: What is the capacity of the AS4C256M8D3-12BIN memory module?
    Answer: The AS4C256M8D3-12BIN is a 256 Megabit (32 Megabyte) memory module.

  2. Question: What is the operating voltage range for the AS4C256M8D3-12BIN?
    Answer: The AS4C256M8D3-12BIN operates at a voltage range of 2.7V to 3.6V.

  3. Question: What is the clock frequency supported by the AS4C256M8D3-12BIN?
    Answer: The AS4C256M8D3-12BIN supports a clock frequency of up to 166 MHz.

  4. Question: What is the data transfer rate of the AS4C256M8D3-12BIN?
    Answer: The AS4C256M8D3-12BIN has a maximum data transfer rate of 333 Mbps.

  5. Question: Is the AS4C256M8D3-12BIN compatible with DDR3 memory controllers?
    Answer: Yes, the AS4C256M8D3-12BIN is designed to be compatible with DDR3 memory controllers.

  6. Question: Can the AS4C256M8D3-12BIN be used in both desktop and laptop computers?
    Answer: Yes, the AS4C256M8D3-12BIN can be used in both desktop and laptop computers as long as they support DDR3 memory.

  7. Question: Does the AS4C256M8D3-12BIN support ECC (Error Correction Code)?
    Answer: No, the AS4C256M8D3-12BIN does not support ECC. It is a non-ECC memory module.

  8. Question: What is the operating temperature range for the AS4C256M8D3-12BIN?
    Answer: The AS4C256M8D3-12BIN has an operating temperature range of -40°C to +85°C.

  9. Question: Can the AS4C256M8D3-12BIN be used in industrial applications?
    Answer: Yes, the AS4C256M8D3-12BIN is suitable for use in industrial applications due to its wide operating temperature range.

  10. Question: Is the AS4C256M8D3-12BIN a single-sided or double-sided memory module?
    Answer: The AS4C256M8D3-12BIN is a single-sided memory module, meaning all the memory chips are located on one side of the module.