Alliance Memory, Inc.
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AS4C32M16D2B-25BINTR

AS4C32M16D2B-25BINTR

Product Overview

Category

AS4C32M16D2B-25BINTR belongs to the category of semiconductor memory products.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and other digital systems.

Characteristics

  • High-speed performance
  • Large storage capacity
  • Low power consumption
  • Reliable data retention
  • Compact package size

Package

AS4C32M16D2B-25BINTR is available in a compact package that ensures easy integration into various electronic devices.

Essence

The essence of AS4C32M16D2B-25BINTR lies in its ability to provide efficient and reliable storage capabilities for electronic devices.

Packaging/Quantity

AS4C32M16D2B-25BINTR is typically packaged in trays or reels, depending on the quantity ordered. The exact packaging and quantity can vary based on customer requirements.

Specifications

  • Part Number: AS4C32M16D2B-25BINTR
  • Memory Type: Synchronous DRAM (SDRAM)
  • Organization: 32M words x 16 bits x 2 banks
  • Operating Voltage: 2.5V
  • Speed Grade: -25
  • Interface: Double Data Rate (DDR2)
  • Package Type: BGA (Ball Grid Array)
  • Pin Count: 84 pins
  • Temperature Range: Industrial (-40°C to +85°C)

Detailed Pin Configuration

The AS4C32M16D2B-25BINTR has a total of 84 pins. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VDD
  20. DQM0
  21. DQM1
  22. VSS
  23. BA0
  24. BA1
  25. A0
  26. A1
  27. A2
  28. A3
  29. A4
  30. A5
  31. A6
  32. A7
  33. A8
  34. A9
  35. A10
  36. A11
  37. A12
  38. A13
  39. A14
  40. A15
  41. A16
  42. A17
  43. A18
  44. A19
  45. A20
  46. A21
  47. A22
  48. A23
  49. VSS
  50. CKE
  51. CS0#
  52. CS1#
  53. WE#
  54. RAS#
  55. CAS#
  56. DM0
  57. DM1
  58. VSS
  59. CLK
  60. ODT0
  61. ODT1
  62. VREF
  63. VSS
  64. VDD
  65. VDD
  66. VSS
  67. VSS
  68. VSS
  69. VSS
  70. VSS
  71. VSS
  72. VSS
  73. VSS
  74. VSS
  75. VSS
  76. VSS
  77. VSS
  78. VSS
  79. VSS
  80. VSS
  81. VSS
  82. VSS
  83. VSS
  84. VSS

Functional Features

  • High-speed data transfer rate
  • Burst mode operation for efficient data access
  • Auto-refresh and self-refresh modes for power-saving
  • On-die termination (ODT) for improved signal integrity
  • Error correction code (ECC) support for data reliability

Advantages and Disadvantages

Advantages

  • Fast data transfer speed enhances overall system performance.
  • Large storage capacity allows for storing a significant amount of data.
  • Low power consumption helps in extending battery life for portable devices.
  • Reliable data retention ensures data integrity over time.
  • Compact package size enables easy integration into various electronic devices.

Disadvantages

  • Higher cost compared to other memory technologies.
  • Limited scalability beyond a certain storage capacity.
  • Requires proper handling and static discharge precautions during installation.

Working Principles

AS4C32M16D2B-25BINTR operates based on the principles of synchronous dynamic random-access memory (SDRAM). It utilizes a clock signal to synchronize data transfers between the memory module and the host device. The data is

Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de AS4C32M16D2B-25BINTR en soluciones técnicas

Sure! Here are 10 common questions and answers related to the application of AS4C32M16D2B-25BINTR in technical solutions:

  1. Question: What is the AS4C32M16D2B-25BINTR?
    - Answer: The AS4C32M16D2B-25BINTR is a specific type of memory chip commonly used in technical solutions.

  2. Question: What is the capacity of the AS4C32M16D2B-25BINTR?
    - Answer: The AS4C32M16D2B-25BINTR has a capacity of 32 megabits (Mb) or 4 megabytes (MB).

  3. Question: What is the speed rating of the AS4C32M16D2B-25BINTR?
    - Answer: The AS4C32M16D2B-25BINTR has a speed rating of 25 nanoseconds (ns), indicating its access time.

  4. Question: What is the pin configuration of the AS4C32M16D2B-25BINTR?
    - Answer: The AS4C32M16D2B-25BINTR has a 90-ball BGA (Ball Grid Array) package with specific pin assignments.

  5. Question: Can the AS4C32M16D2B-25BINTR be used in embedded systems?
    - Answer: Yes, the AS4C32M16D2B-25BINTR is commonly used in embedded systems due to its compact size and high performance.

  6. Question: Is the AS4C32M16D2B-25BINTR compatible with different voltage levels?
    - Answer: Yes, the AS4C32M16D2B-25BINTR supports a wide voltage range, typically from 2.3V to 3.6V.

  7. Question: What is the operating temperature range of the AS4C32M16D2B-25BINTR?
    - Answer: The AS4C32M16D2B-25BINTR has an operating temperature range of -40°C to +85°C.

  8. Question: Can the AS4C32M16D2B-25BINTR be used in high-speed data transfer applications?
    - Answer: Yes, the AS4C32M16D2B-25BINTR is designed for high-speed data transfer and can be used in such applications.

  9. Question: Does the AS4C32M16D2B-25BINTR support error correction codes (ECC)?
    - Answer: No, the AS4C32M16D2B-25BINTR does not have built-in ECC functionality.

  10. Question: Are there any specific design considerations when using the AS4C32M16D2B-25BINTR?
    - Answer: It is important to ensure proper power supply and signal integrity while designing with the AS4C32M16D2B-25BINTR, following the manufacturer's guidelines and recommendations.

Please note that the answers provided here are general and may vary depending on the specific technical solution or application.