AS4C64M16D2A-25BINTR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-speed performance
  • Large storage capacity
  • Low power consumption
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Tray, 250 units per tray

Specifications

• Part Number: AS4C64M16D2A-25BINTR
• Organization: 64 Meg x 16
• Voltage: 2.5V
• Speed: 200 MHz
• Operating Temperature Range: -40°C to +85°C
• Data Rate: 400 Mbps
• Interface: Parallel
• Refresh: Auto-refresh and self-refresh modes
• Burst Length: 1, 2, 4, 8, full page
• CAS Latency: 2, 3
• Package Dimensions: 13mm x 9mm

Detailed Pin Configuration

The AS4C64M16D2A-25BINTR has a total of 90 pins arranged in a specific configuration. The pinout diagram is as follows:

```

Pin Name Description

1 VDD Power supply 2 VDDQ Power supply for I/O buffers 3 DQ0 Data input/output bit 0 4 DQ1 Data input/output bit 1 5 DQ2 Data input/output bit 2 ... 90 VSS Ground ```

Functional Features

• High-speed operation allows for quick data access.
• Large storage capacity enables the storage of a significant amount of data.
• Low power consumption helps conserve energy.
• Auto-refresh and self-refresh modes ensure data integrity during extended periods of inactivity.
• Multiple burst lengths provide flexibility in data transfer.
• CAS latency options allow for optimized performance based on specific requirements.

Advantages and Disadvantages

Advantages

• High-speed performance enables faster data processing.
• Large storage capacity accommodates extensive data storage needs.
• Low power consumption helps reduce energy costs.
• Auto-refresh and self-refresh modes ensure data integrity during power fluctuations or system downtime.
• Multiple burst lengths and CAS latency options offer versatility in data transfer and performance optimization.

Disadvantages

• The BGA package may require specialized equipment for installation and replacement.
• The high-speed operation may not be necessary for all applications, potentially leading to higher costs for unnecessary performance capabilities.

Working Principles

The AS4C64M16D2A-25BINTR is a dynamic random access memory (DRAM) module. It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. When the processor requests data from the memory, the DRAM module retrieves the requested data and transfers it to the processor for further processing.

Detailed Application Field Plans

The AS4C64M16D2A-25BINTR memory module finds applications in various fields, including: 1. Personal Computers (PCs) 2. Laptops and Notebooks 3. Servers and Data Centers 4. Networking Equipment 5. Consumer Electronics

Detailed and Complete Alternative Models

Some alternative models that can be considered as alternatives to the AS4C64M16D2A-25BINTR are: 1. AS4C64M16D2A-25BCNTR 2. AS4C64M16D2A-25BCINTR 3. AS4C64M16D2A-25BCN

These models offer similar specifications and functionality, providing options for different design requirements.

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