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CY7C2565KV18-400BZC

CY7C2565KV18-400BZC

Product Overview

Category

The CY7C2565KV18-400BZC belongs to the category of high-speed synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

  • High Speed: The CY7C2565KV18-400BZC operates at a clock frequency of 400 MHz, enabling rapid data access.
  • Large Capacity: With a capacity of 256 Megabits (32 Megabytes), it offers ample storage space for demanding applications.
  • Synchronous Interface: The chip utilizes a synchronous interface, allowing for efficient communication with other components.
  • Low Power Consumption: It is designed to minimize power consumption, making it suitable for battery-powered devices.
  • Reliable Performance: The SRAM technology ensures stable and consistent operation, even under challenging conditions.

Package and Quantity

The CY7C2565KV18-400BZC is available in a compact BGA (Ball Grid Array) package. Each package contains a single chip.

Specifications

  • Capacity: 256 Megabits (32 Megabytes)
  • Clock Frequency: 400 MHz
  • Interface: Synchronous
  • Supply Voltage: 1.8V
  • Operating Temperature Range: -40°C to +85°C
  • Package Type: BGA
  • Pin Count: 165

Detailed Pin Configuration

The CY7C2565KV18-400BZC features a total of 165 pins, each serving a specific function. Here is a brief overview of the pin configuration:

  • VDDQ: Power supply voltage for I/O buffers
  • VDD: Power supply voltage for core logic
  • GND: Ground connection
  • CLK: Clock input for synchronous operation
  • DQ[0:15]: Data input/output pins
  • A[0:17]: Address input pins
  • CS: Chip select input
  • WE: Write enable input
  • OE: Output enable input

Please refer to the product datasheet for a complete pin configuration diagram.

Functional Features

The CY7C2565KV18-400BZC offers several functional features that enhance its performance and usability:

  • Burst Mode Operation: It supports burst mode access, allowing for efficient data transfer.
  • Automatic Power Down: The chip includes a power-down feature that reduces power consumption when not in use.
  • Asynchronous Output Enable: The asynchronous output enable function enables immediate access to data.
  • Byte Write Capability: It provides the flexibility to write data at the byte level, enhancing efficiency in certain applications.

Advantages and Disadvantages

Advantages

  • High-speed operation enables rapid data access.
  • Large capacity accommodates demanding storage requirements.
  • Low power consumption makes it suitable for energy-efficient devices.
  • Reliable performance ensures stable operation in various conditions.
  • Burst mode and byte write capability enhance data transfer efficiency.

Disadvantages

  • Limited compatibility with certain legacy systems that require different interface standards.
  • Relatively higher cost compared to other memory technologies.

Working Principles

The CY7C2565KV18-400BZC operates based on the principles of static random access memory. It stores data using flip-flops, which retain information as long as power is supplied. The synchronous interface allows for precise timing and coordinated communication between the chip and other components.

When a read or write operation is initiated, the address lines specify the location of the data within the memory array. The chip's internal circuitry then retrieves or stores the data accordingly. The synchronous nature of the interface ensures that data is transferred accurately and efficiently.

Detailed Application Field Plans

The CY7C2565KV18-400BZC finds applications in various fields, including:

  1. Computing Systems: It is used in high-performance computers and servers to provide fast and reliable memory for data processing.
  2. Networking Equipment: The chip is employed in routers, switches, and network appliances to store routing tables and buffer data packets.
  3. Telecommunications Systems: It is utilized in telecommunications infrastructure equipment to store call records, signaling information, and firmware.
  4. Industrial Automation: The SRAM chip is integrated into industrial control systems for storing critical data and program code.
  5. Medical Devices: It finds application in medical imaging equipment, patient monitoring systems, and diagnostic devices that require high-speed data storage.

Detailed and Complete Alternative Models

  1. MT48LC32M16A2P-75: A 256 Megabit synchronous SRAM with similar specifications and performance characteristics.
  2. IS61WV102416BLL-10TLI: A 256 Megabit low-power synchronous SRAM suitable for battery-powered devices.
  3. AS7C325

Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de CY7C2565KV18-400BZC en soluciones técnicas

Sure! Here are 10 common questions and answers related to the application of CY7C2565KV18-400BZC in technical solutions:

  1. Question: What is the maximum operating frequency of CY7C2565KV18-400BZC?
    Answer: The maximum operating frequency of CY7C2565KV18-400BZC is 400 MHz.

  2. Question: What is the capacity of CY7C2565KV18-400BZC?
    Answer: CY7C2565KV18-400BZC has a capacity of 256 Megabits (32 Megabytes).

  3. Question: What is the voltage supply range for CY7C2565KV18-400BZC?
    Answer: The voltage supply range for CY7C2565KV18-400BZC is 1.7V to 1.9V.

  4. Question: Can CY7C2565KV18-400BZC be used in automotive applications?
    Answer: Yes, CY7C2565KV18-400BZC is suitable for automotive applications.

  5. Question: Does CY7C2565KV18-400BZC support burst mode operation?
    Answer: Yes, CY7C2565KV18-400BZC supports burst mode operation.

  6. Question: What is the data transfer rate of CY7C2565KV18-400BZC?
    Answer: The data transfer rate of CY7C2565KV18-400BZC is 800 Mbps.

  7. Question: Is CY7C2565KV18-400BZC compatible with DDR3 SDRAM interfaces?
    Answer: Yes, CY7C2565KV18-400BZC is compatible with DDR3 SDRAM interfaces.

  8. Question: Can CY7C2565KV18-400BZC be used in high-performance computing systems?
    Answer: Yes, CY7C2565KV18-400BZC is suitable for high-performance computing systems.

  9. Question: Does CY7C2565KV18-400BZC support on-die termination (ODT)?
    Answer: Yes, CY7C2565KV18-400BZC supports on-die termination (ODT).

  10. Question: What is the package type of CY7C2565KV18-400BZC?
    Answer: CY7C2565KV18-400BZC comes in a 165-ball BGA package.