8N3SV75KC-0167CDI

Product Overview

Category

The 8N3SV75KC-0167CDI belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit with advanced functionality
• High performance and reliability
• Compact size for space-constrained applications
• Low power consumption
• Wide operating temperature range

Package

The 8N3SV75KC-0167CDI is available in a small form factor package, suitable for surface mount technology (SMT) assembly.

Essence

This integrated circuit serves as a key component in electronic systems, enabling efficient signal processing and control functions.

Packaging/Quantity

The 8N3SV75KC-0167CDI is typically packaged in reels or trays, depending on the manufacturer's specifications. The quantity per package may vary, but it is commonly available in quantities of 1000 units.

Specifications

• Model: 8N3SV75KC-0167CDI
• Supply Voltage: 3.3V
• Operating Temperature Range: -40°C to +85°C
• Input/Output Interface: SPI (Serial Peripheral Interface)
• Clock Frequency: Up to 10 MHz
• Number of Pins: 16
• Package Type: QFN (Quad Flat No-leads)

Detailed Pin Configuration

1. VDD: Power supply voltage input
2. GND: Ground reference
3. SCLK: Serial clock input for SPI communication
4. MOSI: Master output, slave input for SPI communication
5. MISO: Master input, slave output for SPI communication
6. CS: Chip select input for SPI communication
7. INT: Interrupt output
8. A0: Address input bit 0
9. A1: Address input bit 1
10. A2: Address input bit 2
11. NC: No connection
12. NC: No connection
13. NC: No connection
14. NC: No connection
15. NC: No connection
16. NC: No connection

Functional Features

• SPI interface for easy integration with microcontrollers and other devices
• Built-in interrupt functionality for event-driven applications
• Addressable configuration options for customization
• High-speed data transfer capability
• Low power consumption for energy-efficient designs

Advantages and Disadvantages

Advantages

• Compact size allows for space-saving designs
• Wide operating temperature range enables usage in various environments
• High performance and reliability ensure consistent operation
• Versatile application possibilities due to the SPI interface

Disadvantages

• Limited number of addressable configuration options
• Relatively high cost compared to simpler ICs
• Requires knowledge of SPI communication protocol for proper utilization

Working Principles

The 8N3SV75KC-0167CDI operates based on the principles of digital signal processing and control. It receives input signals through the SPI interface, processes them according to its internal logic, and generates output signals or triggers interrupts based on predefined conditions. The integrated circuit's functionality is determined by its firmware or software programming.

Detailed Application Field Plans

The 8N3SV75KC-0167CDI finds applications in various fields, including but not limited to: - Telecommunications: Used in network equipment, routers, and modems for signal processing and control functions. - Consumer Electronics: Integrated into audio/video devices, gaming consoles, and smart home systems for data handling and control purposes. - Industrial Equipment: Employed in automation systems, robotics, and industrial control units for precise control and monitoring tasks.

Detailed and Complete Alternative Models

1. 8N3SV75KC-0167CDI-1: Similar specifications with additional features for enhanced functionality.
2. 8N3SV75KC-0167CDI-2: Lower power consumption variant with reduced operating temperature range.
3. 8N3SV75KC-0167CDI-3: Higher clock frequency version for applications requiring faster data transfer.

These alternative models provide options based on specific requirements and can be considered as alternatives to the 8N3SV75KC-0167CDI.

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