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IS43DR82560B-25EBL
Product Overview
Category: Integrated Circuit (IC)
Use: Memory device
Characteristics: - High-speed operation - Low power consumption - Large storage capacity - Compact size
Package: BGA (Ball Grid Array)
Essence: This IC is a high-performance memory device designed for various applications that require fast and reliable data storage.
Packaging/Quantity: The IS43DR82560B-25EBL is typically packaged in reels and comes in quantities of 1000 units per reel.
Specifications
- Memory Type: Synchronous DRAM (SDRAM)
- Memory Size: 256 Megabits (32 Megabytes)
- Operating Voltage: 2.5V
- Operating Temperature Range: -40°C to +85°C
- Clock Frequency: 200 MHz
- Data Rate: 400 Mbps
- Interface: Parallel
- Pin Count: 90 pins
Detailed Pin Configuration
The IS43DR82560B-25EBL has a total of 90 pins, each serving a specific function. Here is a detailed pin configuration:
- VDDQ
- DQ0
- DQ1
- DQ2
- DQ3
- DQ4
- DQ5
- DQ6
- DQ7
- DQ8
- DQ9
- DQ10
- DQ11
- DQ12
- DQ13
- DQ14
- DQ15
- DQM0
- DQM1
- DQS0
- DQS1
- DM0
- DM1
- CAS
- RAS
- WE
- CKE
- CS
- BA0
- BA1
- A0
- A1
- A2
- A3
- A4
- A5
- A6
- A7
- A8
- A9
- A10
- A11
- A12
- A13
- A14
- A15
- A16
- A17
- A18
- A19
- A20
- A21
- A22
- VSS
- VDD
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- VSSQ
Functional Features
- High-speed data transfer
- Burst mode operation
- Auto-refresh and self-refresh modes
- On-die termination (ODT) for improved signal integrity
- Low-power standby mode
- Easy integration with various systems
Advantages and Disadvantages
Advantages: - Fast data access and transfer speeds - Large storage capacity - Low power consumption - Compact size for space-constrained applications - Reliable performance
Disadvantages: - Higher cost compared to other memory technologies - Limited compatibility with older systems that do not support SDRAM
Working Principles
The IS43DR82560B-25EBL operates based on the synchronous dynamic random-access memory (SDRAM) technology. It stores data in a matrix of capacitors, which are organized into rows and columns. The memory cells are accessed by sending row and column addresses along with control signals. The data is read from or written to the memory cells using a clock signal for synchronization.
Detailed Application Field Plans
The IS43DR82560B-25EBL is widely used in various electronic devices and systems, including: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics (e.g., smartphones, tablets) - Automotive electronics - Industrial automation systems
Detailed and Complete Alternative Models
- IS43DR82560C-25EBL
- Similar specifications and features as IS43DR82560B-25EBL
- Improved power efficiency
- Enhanced data transfer
Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de IS43DR82560B-25EBL en soluciones técnicas
Sure! Here are 10 common questions and answers related to the application of IS43DR82560B-25EBL in technical solutions:
Q: What is IS43DR82560B-25EBL? A: IS43DR82560B-25EBL is a specific model of DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip.
Q: What is the capacity of IS43DR82560B-25EBL? A: The IS43DR82560B-25EBL has a capacity of 256 Megabits (Mb), which is equivalent to 32 Megabytes (MB).
Q: What is the operating voltage range for IS43DR82560B-25EBL? A: The operating voltage range for IS43DR82560B-25EBL is typically between 1.425V and 1.575V.
Q: What is the maximum clock frequency supported by IS43DR82560B-25EBL? A: The maximum clock frequency supported by IS43DR82560B-25EBL is 400 MHz.
Q: What is the data transfer rate of IS43DR82560B-25EBL? A: The data transfer rate of IS43DR82560B-25EBL is 800 Megabits per second (Mbps).
Q: What is the package type of IS43DR82560B-25EBL? A: IS43DR82560B-25EBL comes in a 96-ball BGA (Ball Grid Array) package.
Q: Can IS43DR82560B-25EBL be used in automotive applications? A: Yes, IS43DR82560B-25EBL is designed to meet the requirements of automotive applications.
Q: What are the temperature range specifications for IS43DR82560B-25EBL? A: The temperature range specifications for IS43DR82560B-25EBL are typically between -40°C and +105°C.
Q: Is IS43DR82560B-25EBL compatible with other DDR3 SDRAM chips? A: Yes, IS43DR82560B-25EBL is compatible with other DDR3 SDRAM chips that operate at similar voltage and frequency levels.
Q: What are some typical applications of IS43DR82560B-25EBL? A: IS43DR82560B-25EBL is commonly used in various technical solutions such as automotive electronics, industrial control systems, networking equipment, and telecommunications devices.
Please note that the answers provided here are general and may vary depending on specific product datasheets and manufacturer specifications.