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MT47H64M8CB-37E:B

MT47H64M8CB-37E:B

Product Overview

Category

MT47H64M8CB-37E:B belongs to the category of dynamic random access memory (DRAM) chips.

Use

This product is primarily used in electronic devices such as computers, laptops, servers, and mobile phones for storing and accessing data quickly.

Characteristics

  • High-speed data storage and retrieval capabilities
  • Low power consumption
  • Compact size
  • Wide operating temperature range
  • Reliable performance

Package

MT47H64M8CB-37E:B is available in a small outline dual in-line memory module (SODIMM) package.

Essence

The essence of this product lies in its ability to provide fast and efficient data storage and retrieval in various electronic devices.

Packaging/Quantity

MT47H64M8CB-37E:B is typically packaged in trays or reels and is available in different quantities depending on customer requirements.

Specifications

  • Memory Type: DDR3 SDRAM
  • Capacity: 512 Megabytes (MB)
  • Organization: 64 Megabits x 8
  • Speed: 1333 Megahertz (MHz)
  • Voltage: 1.5 Volts (V)
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The detailed pin configuration of MT47H64M8CB-37E:B is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. NC
  12. DQ8
  13. DQ9
  14. DQ10
  15. DQ11
  16. DQ12
  17. DQ13
  18. DQ14
  19. DQ15
  20. VSS
  21. NC
  22. NC
  23. NC
  24. A0
  25. A1
  26. A2
  27. A3
  28. A4
  29. A5
  30. A6
  31. A7
  32. VSS
  33. A8
  34. A9
  35. A10
  36. A11
  37. A12
  38. A13
  39. A14
  40. A15
  41. VSS
  42. BA0
  43. BA1
  44. RAS#
  45. CAS#
  46. WE#
  47. CS#
  48. VSS
  49. DM0
  50. DM1
  51. VREF
  52. VDD

Functional Features

  • High-speed data transfer rate
  • Burst mode operation for efficient data access
  • Auto-refresh and self-refresh modes for power-saving
  • On-die termination (ODT) for improved signal integrity
  • Error correction code (ECC) support for data reliability

Advantages and Disadvantages

Advantages

  • Fast data transfer rate enhances overall system performance
  • Low power consumption prolongs battery life in portable devices
  • Compact size allows for integration in space-constrained designs
  • Wide operating temperature range ensures reliable operation in various environments

Disadvantages

  • Limited capacity compared to higher-end memory modules
  • Compatibility may vary with different device architectures
  • Higher cost per unit compared to lower-capacity memory options

Working Principles

MT47H64M8CB-37E:B operates based on the principles of dynamic random access memory. It stores data in capacitors within each memory cell, which are periodically refreshed to maintain the stored information. When data needs to be accessed, the memory controller sends appropriate signals to read or write data from/to specific memory locations.

Detailed Application Field Plans

MT47H64M8CB-37E:B finds applications in various electronic devices, including but not limited to: - Personal computers - Laptops and notebooks - Servers and workstations - Mobile phones and tablets - Networking equipment - Industrial control systems

Detailed and Complete Alternative Models

Some alternative models that offer similar functionality to MT47H64M8CB-37E:B include: - MT47H64M16HR-25E:A - MT47H64M16HR-3IT:E - MT47H64M16HR-3IT:H - MT47H64M16HR-3IT:K

These alternative models provide different capacities, speeds, and voltage options to cater to diverse application requirements.

In conclusion, MT47H64M8CB-37E:B is a DDR3 SDRAM chip primarily used for high-speed data storage and retrieval in various electronic devices. It offers advantages such as fast performance, low power consumption, and compact size. However

Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de MT47H64M8CB-37E:B en soluciones técnicas

Sure! Here are 10 common questions and answers related to the application of MT47H64M8CB-37E:B in technical solutions:

  1. Question: What is the capacity of the MT47H64M8CB-37E:B memory module?
    Answer: The MT47H64M8CB-37E:B has a capacity of 512 megabytes (MB).

  2. Question: What is the operating voltage range for this memory module?
    Answer: The operating voltage range for the MT47H64M8CB-37E:B is 2.5V to 2.75V.

  3. Question: Is the MT47H64M8CB-37E:B compatible with DDR3 memory interfaces?
    Answer: Yes, the MT47H64M8CB-37E:B is designed to be compatible with DDR3 memory interfaces.

  4. Question: What is the maximum clock frequency supported by this memory module?
    Answer: The MT47H64M8CB-37E:B supports a maximum clock frequency of 667 MHz.

  5. Question: Can I use multiple MT47H64M8CB-37E:B modules together in a system?
    Answer: Yes, you can use multiple MT47H64M8CB-37E:B modules together to increase the overall memory capacity of your system.

  6. Question: Does the MT47H64M8CB-37E:B support ECC (Error Correction Code)?
    Answer: No, the MT47H64M8CB-37E:B does not support ECC. It is a non-ECC memory module.

  7. Question: What is the form factor of the MT47H64M8CB-37E:B?
    Answer: The MT47H64M8CB-37E:B has a small outline dual in-line memory module (SO-DIMM) form factor.

  8. Question: Is the MT47H64M8CB-37E:B suitable for use in laptops or other mobile devices?
    Answer: Yes, the SO-DIMM form factor of the MT47H64M8CB-37E:B makes it well-suited for use in laptops and other mobile devices.

  9. Question: Can I use the MT47H64M8CB-37E:B in both single-channel and dual-channel memory configurations?
    Answer: Yes, the MT47H64M8CB-37E:B can be used in both single-channel and dual-channel memory configurations, depending on your system's requirements.

  10. Question: What is the operating temperature range for the MT47H64M8CB-37E:B?
    Answer: The MT47H64M8CB-37E:B has an operating temperature range of -40°C to +85°C, making it suitable for a wide range of environments.

Please note that these answers are based on general information about the MT47H64M8CB-37E:B memory module. For specific technical details and application guidelines, it is recommended to refer to the manufacturer's datasheet or consult with a qualified engineer.