Memory chip

Número de pieza
WINBOND (Winbond)
Fabricantes
Descripción
67657 PCS
En stock
Número de pieza
MK (Mike Foundry)
Fabricantes
SD NAND 4Gbit, SLC, industrial grade wide temperature, -40°C to +85°C; alias SMD TF card, built-in ECC check, bad block management, wear average algorithm, 10,000 abnormal power failure protection and other functions .
Descripción
73718 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
90458 PCS
En stock
Número de pieza
micron
Fabricantes
Descripción
61192 PCS
En stock
Número de pieza
onsemi (Ansemi)
Fabricantes
Descripción
97591 PCS
En stock
Número de pieza
SAMSUNG (Samsung Semiconductor)
Fabricantes
Descripción
74921 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
84082 PCS
En stock
Número de pieza
MK (Mike Foundry)
Fabricantes
SD NAND 1Gbit, SLC, industrial-grade wide temperature, -40°C to +85°C; alias SMD TF card, SDNAND, embedded ECC check, bad block management, wear average algorithm, 10,000 abnormal power failure protection and other functions.
Descripción
64790 PCS
En stock
Número de pieza
ST (STMicroelectronics)
Fabricantes
Descripción
62560 PCS
En stock
Número de pieza
ATO SOLUTION
Fabricantes
Descripción
69620 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
56071 PCS
En stock
Número de pieza
CYPRESS (Cypress)
Fabricantes
256-Kbit (32K × 8bit), I2C interface, working voltage: 2.7V to 5.5V
Descripción
51155 PCS
En stock
Número de pieza
FMD (Hui Mang Micro)
Fabricantes
Descripción
56143 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
97387 PCS
En stock
Número de pieza
FM (Fudan Micro)
Fabricantes
Descripción
54414 PCS
En stock
Número de pieza
Metorage (Spark Semiconductor)
Fabricantes
MMC eMMC 128GB TLC Industrial -25~85℃, application fields: industrial control, automotive electronics, medical
Descripción
99656 PCS
En stock
Número de pieza
CS (Creation)
Fabricantes
Driver-free use, standard SDIO interface, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller, high consistency; Built-in SLC wafer, 10W erasing and writing life, passed 10,000 random power-off tests. \n\nCS (Genesis) SD NAND is also called by many developers friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, industrial grade TF card, Industrial grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)
Descripción
78905 PCS
En stock
micron
Fabricantes
Descripción
56158 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
61889 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
99013 PCS
En stock